MCP6051 Datasheet, PDF (31/34 Pages) Microchip Technology – 30 μA, High Precision Op Amps

MCP6051/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature Package
Range
Device:
MCP6051:
MCP6051T:
MCP6052:
MCP6052T:
MCP6054:
MCP6054T:
Single Op Amp
Single Op Amp (Tape and Reel)
(SOIC and 2x3 TDFN)
Dual Op Amp
Dual Op Amp (Tape and Reel)
(SOIC and 2x3 TDFN)
Quad Op Amp
Quad Op Amp (Tape and Reel)
(SOIC and TSSOP)
Temperature Range: E = -40°C to +125°C
Package:
MNY * = Plastic Dual Flat, No Lead, (2x3 TDFN ) 8-lead
SL = Plastic SOIC (150 mil Body), 14-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
ST = Plastic TSSOP (4.4mm Body), 14-lead
* Y = Nickel palladium gold manufacturing designator. Only
available on the TDFN package.
Examples:
a) MCP6051-E/SN: 8LD SOIC package
b) MCP6051T-E/SN: Tape and Reel,
8LD SOIC package
c) MCP6051-E/MNY: 8LD 2x3 TDFN package
d) MCP6051T-E/MNY: Tape and Reel,
8LD 2x3 TDFN package
a) MCP6052-E/SN: 8LD SOIC package
b) MCP6052T-E/SN: Tape and Reel,
8LD SOIC package
c) MCP6052-E/MNY: 8LD 2x3 TDFN package
d) MCP6052T-E/MNY: Tape and Reel
8LD 2x3 TDFN package
a) MCP6054-E/SL:
b) MCP6054T-E/SL:
c) MCP6054-E/ST:
d) MCP6054T-E/ST:
14LD SOIC package
Tape and Reel,
14LD SOIC package
14LD TSSOP package
Tape and Reel,
14LD TSSOP package
© 2009 Microchip Technology Inc.
DS22182A-page 31