24AA025 Datasheet, PDF (31/42 Pages) Microchip Technology – I2C™ Serial EEPROM Family Data Sheet

24AAXX/24LCXX/24FCXX
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
e
b
N
L
NOTE 1
12
TOP VIEW
K
E
EXPOSED PAD
E2
21
D2
BOTTOM VIEW
NOTE 1
A
A3
A1
NOTE 2
Number of Pins
Pitch
Overall Height
Units
Dimension Limits
N
e
A
MILLIMETERS
MIN
NOM
MAX
8
0.50 BSC
0.80
0.90
1.00
Standoff
Contact Thickness
Overall Length
A1
0.00
0.02
0.05
A3
0.20 REF
D
2.00 BSC
Overall Width
Exposed Pad Length
Exposed Pad Width
E
3.00 BSC
D2
1.30
–
1.75
E2
1.50
–
1.90
Contact Width
b
0.18
0.25
0.30
Contact Length
L
0.30
0.40
0.50
Notes:
Contact-to-Exposed Pad
K
0.20
–
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
© 2007 Microchip Technology Inc.
DS21930B-page 31