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TC2054_06 Datasheet, PDF (3/18 Pages) Microchip Technology – 50 mA, 100 mA, and 150 mA CMOS LDOs with Shutdown and Error Output
TC2054/2055/2186
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameter
Sym
Min
Typ
Max Units
Conditions
Output Noise
eN
Response Time
tR
(from Shutdown Mode)
SHDN Input
SHDN Input High Threshold VIH
SHDN Input Low Threshold VIL
ERROR OUTPUT
Minimum VIN Operating
Voltage
VINMIN
Output Logic Low Voltage VOL
ERROR Threshold Voltage
ERROR Positive Hysteresis
VOUT to ERROR Delay
Resistance from ERROR to
GND
VTH
VHYS
tDELAY
RERROR
—
600
—
nV / IL = IOUTMAX, F = 10 kHz
√Hz
—
60
—
µs VIN = 4V
CIN = 1 µF, COUT = 10 µF
IL = 0.1 mA, Note 9
60
—
—
%VIN VIN = 2.5V to 6.0V
—
—
15
%VIN VIN = 2.5V to 6.0V
1.0
—
—
—
—
400
—
0.95 x VR
—
—
50
—
—
2
—
—
126
—
V IOL = 0.1 mA
mV 1 mA Flows to ERROR,
IOL = 1 mA, VIN = 2V
V See Figure 4-2
mV Note 8
ms VOUT from VR = 3V to 2.8V
Ω VDD = 2.5V, VOUT = 2.5V
Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3: TCVOUT = (---V----O-----U-----T----M------A----X------–----V----O------U----T----M------I--N-----)---×-----1----0---6--
VOUT × ΔT
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
at a 1V differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).
8: Hysteresis voltage is referenced by VR.
9: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Temperature Ranges:
Extended Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances:
Thermal Resistance, 5L-SOT-23
TA
-40
—
+125
TA
-40
—
+125
TA
-65
—
+150
θJA
—
255
—
Units
°C
°C
°C
°C/W
Conditions
© 2006 Microchip Technology Inc.
DS21663C-page 3