TC1263_13 Datasheet, PDF (3/18 Pages) Microchip Technology – 500 mA, Fixed-Output, CMOS LDO with Shutdown

TC1263
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, V_IN = V_R + 1.0V, (Note 1), I_L = 100 µA, C_L = 3.3 µF,
SHDN > V_IH, T_A = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
SHDN Input
SHDN Input High Threshold
SHDN Input Low Threshold
ERROR Output (SOIC Only)
V_IH
45
—
—
%V_IN
V_IL
—
—
15
%V_IN
Minimum Operating Voltage
V_MIN
1.0
—
—
V
Output Logic Low Voltage
V_OL
—
—
400
mV 1 mA Flows to ERROR
ERROR Threshold Voltage
V_TH
—
0.95 x V_R
—
V
ERROR Positive Hysteresis
V_HYS
—
50
—
mV
Note 1:
2:
3:
4:
5:
6:
7:
V_R is the regulator output voltage setting.
The minimum V_IN has to justify the conditions: V_IN  V_R + V_DROPOUT and V_IN  2.7V for I_L = 0.1 mA to I_OUTMAX.
TCV_OUT = ^---^V----^O----^U---^T---^M----^A---_V-^X---_O-^–--_U---^V-_T---^O-_--^U---_-^T---_T^M----^I--^N----^---^–-----1---0---⁶-
Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.0V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I_LMAX at V_IN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., T_A, T_J, _JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V_IN = V_R + 1.0V, I_L = 100 µA, C_L = 3.3 µF,
SHDN > V_IH, T_A = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
T_A
-40
—
+125
°C Note 1
T_J
-40
—
+125
°C
T_A
-65
—
+150
°C
Thermal Resistance, 5L-DDPAK
_JA
—
57
—
°C/W
Thermal Resistance, 5L-TO-220
_JA
—
71
—
°C/W
Thermal Resistance, 8L-SOIC
_JA
—
163
—
°C/W
Note 1: Operation in this range must not cause T_J to exceed Maximum Junction Temperature (+125°C).
 2002-2012 Microchip Technology Inc.
DS21374D-page 3