MCP1810 Datasheet, PDF (26/32 Pages) Microchip Technology – Energy Harvesting

MCP1810
8-Lead Very Thin Plastic Dual Flat, No Lead Package (J8A) - 2x2 mm Body [VDFN]
With 1.7x0.9 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Y2
EV
20
ØV
C X2
G2
CH
Y1
SILK SCREEN
12
E
X1
G1
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
Contact Pad to Pad (X6)
G1
Contact Pad to Center Pad (X8) G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.50 BSC
0.95
1.95
2.10
0.30
0.70
0.20
0.23
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3207A
DS20005623A-page 26
 2016 Microchip Technology Inc.