DSPIC30F6014A-30I Datasheet, PDF (221/238 Pages) Microchip Technology – High-Performance, 16-Bit Digital Signal Controllers

dsPIC30F6011A/6012A/6013A/6014A
80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
#leads = n1
p
D1 D
B
c
β
2
1
n
α
φ
A
L ^A1
(F)
A2
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
80
80
Pitch
p
.026
0.65
Pins per Side
n1
20
20
Overall Height
A
.047
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.006
0.05
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Footprint
Foot Angle
F
.039 REF.
1.00 REF.
φ
0°
3.5°
7°
0°
3.5°
7°
Overall Width
E
.630 BSC
16.00 BSC
Overall Length
D
.630 BSC
16.00 BSC
Molded Package Width
E1
.551 BSC
14.00 BSC
Molded Package Length
D1
.551 BSC
14.00 BSC
Lead Thickness
c
.004
.008
0.09
0.20
Lead Width
B
.011
.013
.015
0.27
0.32
0.37
Mold Draft Angle Top
Mold Draft Angle Bottom
α
11°
12°
13°
11°
12°
13°
β
11°
12°
13°
11°
12°
13°
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Drawing No. C04-116
Revised 7-20-06
© 2006 Microchip Technology Inc.
Preliminary
DS70143C-page 219