RN4870 Datasheet, PDF (21/48 Pages) Microchip Technology – Bluetooth 4.2 Low Energy Module

RN4870/71
FIGURE 4-13:
RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST
PCB BOARD
Acceptable
Best
Acceptable
Lowest
performance
4.5 Soldering Recommendations
The RN4870/71 Bluetooth modules are assembled
using standard lead-free reflow profile IPC/JEDEC
J-STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recom-
mendations are given:
• Microchip Technology Application Note, “AN233
Solder Reflow Recommendation” (DS00233)
provides solder reflow recommendations
• Do not exceed peak temperature (T_P) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
 2016 Microchip Technology Inc.
DS50002489A-page 21