25AA080A Datasheet, PDF (21/24 Pages) Microchip Technology – 8K SPI Bus Serial EEPROM

25XX080A/B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
–
Tape & Reel
X
/XX
Temp Range Package
X
Lead Finish
Device
25AA080A
25AA080B
25LC080A
25LC080B
8 Kbit, 1.8V, 16 Byte Page SPI Serial EEPROM
8 Kbit, 1.8V, 32 Byte Page SPI Serial EEPROM
8 Kbit, 2.5V, 16 Byte Page SPI Serial EEPROM
8 Kbit, 2.5V, 32 Byte Page SPI Serial EEPROM
Tape & Reel
Blank =
T
=
Temperature Range I
=
E
=
Standard packaging
Tape and Reel
-40°C to+85°C
-40°C to+125°C
Package
MS = Plastic MSOP (Micro Small Outline), 8-lead
P
= Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (150 mil body), 8-lead
ST = TSSOP, 8-lead
Examples:
a) 25AA080A-I/MS = 8 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., MSOP
package
b) 25AA080B-I/STG = 8 Kbit, 32-byte page, 1.8V
Serial EEPROM, Industrial temp., TSSOP
package, Pb-free
c) 25AA080AT-I/SN = 8 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
d) 25LC080A-I/MSG = 8 Kbit, 16-byte page, 2.5V
Serial EEPROM, Industrial temp., MSOP
package, Pb-free
e) 25LC080BT-I/SN = 8 Kbit, 32-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
f) 25LC080BT-I/ST = 8 Kbit, 32-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
TSSOP package
Lead Finish
Blank = Standard 63% / 37% Sn/Pb
G
= Matte Tin (Pure Sn)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: [phone]
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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 2003 Microchip Technology Inc.
DS21808B-page 21