TC7135_04 Datasheet, PDF (20/24 Pages) Microchip Technology – 4-1/2 Digit A/D Converter

TC7135
64 Lead Metric Plastic Quad Flat (BU) (MQFP)
E
E1
e
D1 D
B
c
b
2
1
n
L
f
A
A1
(F)
a
A2
Units
Dimension Limits
Number of Pins
n
Pitch
e
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Molded Package Length
D1
Foot Length
L
Footprint (Reference)
(F)
Foot Angle
f
Lead Thickness
c
Lead Width
B
Mold Draft Angle Top
a
Mold Draft Angle Bottom
b
MIN
.098
.098
.000
.029
0°
.004
.011
5°
5°
INCHES
NOM
64
.031 BSC
--
.106
--
.677 BSC
.551 BSC
.677 BSC
.551 BSC
.035
.063 REF
--
--
--
--
--
MAX
.124
.114
.010
.041
6°
.009
.018
16°
16°
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash
or protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: MS-022 BE.
Formerly TelCom PQFP package.
Drawing No. C04-022
MILLIMETERS*
MIN
NOM
64
0.80 BSC
2.50
--
2.50
2.70
0.00
--
17.20 BSC
14.00 BSC
17.20 BSC
14.00 BSC
0.73
0.88
1.60 REF
0°
--
0.11
--
0.29
--
5°
--
5°
--
MAX
3.15
2.90
0.25
1.03
7°
0.23
0.45
16°
16°
DS21460C-page 20
 2004 Microchip Technology Inc.