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TC1306_07 Datasheet, PDF (2/18 Pages) Microchip Technology – Dual 150mA CMOS LDO With Select Mode™ Operation, Shutdown and RESET Output
TC1306
1.0 ELECTRICAL
CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .........................................................6.5V
Output Voltage........................... (-0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 7)
Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V
Operating Temperature Range.... -40°C < TJ < +125°C
Storage Temperature Range ..............-65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1306 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VR + 1V, IL = 100μA, CL = 3.3μF, SHDN1 > VIH, SHDN2 > VIH, TA = 25°C, unless otherwise noted.
Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VIN
IOUTMAX
VOUT
TCVOUT
Input Operating Voltage
Maximum Output Current
Output Voltage (VOUT1 and VOUT2)
VOUT Temperature Coefficient
2.7
150
VR – 2.5%
—
—
—
6.0
V Note 1
—
—
mA Per Channel
VR ± 0.5% VR + 2.5% V Note 2
20
—
ppm/°C Note 3
40
—
ΔVOUT/ΔVIN Line Regulation
ΔVOUT/VOUT Load Regulation
—
0.05
0.35
% (VR + 1V) < VIN < 6V
—
0.3
2
% IL = 0.1mA to IOUTMAX
(Note 4)
VIN – VOUT Dropout Voltage
—
2
—
mV IL = 100μA
45
120
IL = 50mA
85
240
IL = 100mA
125
360
IL = 150mA, (Note 5)
IIN
Supply Current
—
120
200
μA SHDN1, SHDN2 = VIH, IL = 0
IINSD
Shutdown Supply Current
—
0.05
0.5
μA SHDN1, SHDN2 = 0V
PSRR
Power Supply Rejection Ratio
—
55
—
dB FRE ≤ 120Hz
IOUTSC
Output Short Circuit Current
—
450
—
mA VOUT = 0V
ΔVOUTΔPD Thermal Regulation
—
0.04
—
V/W Notes 6, 7
tWK
Wake Up Time
(from Shutdown Mode)
—
10
—
μsec VIN = 5V
CIN = 1μF, COUT = 4.7μF
IL = 30mA, (See Figure 4-1)
ts
Settling Time
(from Shutdown Mode)
—
40
—
μsec VIN = 5V
CIN = 1μF, COUT = 4.7μF
IL = 30mA, (See Figure 4-1)
Note 1:
2:
3:
4:
5:
6:
7:
The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN = VR + VDROPOUT.
VR is the regulator output voltage setting. For example: VR = 2.8V, 3.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ΔT
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation
specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V
differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
DS21527C-page 2
© 2007 Microchip Technology Inc.