TC1223_13 Datasheet, PDF (2/16 Pages) Microchip Technology – 50mA and 100mA CMOS LDOs with Shutdown

TC1223/TC1224
1.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage........................... (-0.3V) to (V_IN + 0.3V)
Power Dissipation.............................. Internally Limited
Maximum Voltage on Any Pin ........V_IN +0.3V to -0.3V
Operating Temperature Range...... -40°C < T_J < 125°C
Storage Temperature..........................-65°C to +150°C
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1223/TC1224 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V_IN = V_OUT + 1V, I_L = 100A, C_L = 3.3F, SHDN > V_IH, T_A = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V_IN
I_OUTMAX
Input Operating Voltage
Maximum Output Current
2.7
—
50
—
100
—
6.0
V Note 8
—
mA TC1223
—
TC1224
V_OUT
TCV_OUT
Output Voltage
V_OUT Temperature Coefficient
V_R – 2.5%
—
—
V_R ±0.5%
20
40
V_R + 2.5%
—
—
V
ppm/°C
Note 1
Note 2
V_OUT/V_IN
V_OUT/V_OUT
Line Regulation
Load Regulation
—
0.05
0.35
% (V_R + 1V) V_IN6V
—
0.5
2
%
I_L = 0.1mA to I_OUTMAX
(Note 3)
V_IN-V_OUT
Dropout Voltage
—
—
—
TC1224
—
I_IN
Supply Current
—
I_INSD
Shutdown Supply Current
—
PSRR
Power Supply Rejection Ratio
—
I_OUTSC
Output Short Circuit Current
—
V_OUT/P_D Thermal Regulation
—
T_SD
Thermal Shutdown Die Temperature
—
T_SD
Thermal Shutdown Hysteresis
—
eN
Output Noise
—
SHDN Input
2
65
85
180
50
0.05
64
300
0.04
160
10
260
—
mV I_L = 100A
—
I_L = 20mA
120
I_L = 50mA
250
I_L = 100mA (Note 4)
80
A SHDN = V_IH, I_L = 0 (Note 7)
0.5
A SHDN = 0V
—
dB F_RE 1kHz
450
mA V_OUT = 0V
—
V/W Notes 5, 6
—
°C
—
°C
—
nV/Hz I_L = I_OUTMAX
V_IH
SHDN Input High Threshold
45
—
—
%V_IN V_IN = 2.5V to 6.5V
V_IL
SHDN Input Low Threshold
—
—
15
%V_IN V_IN = 2.5V to 6.5V
Note 1: V_R is the regulator output voltage setting. For example: V_R = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
2: TC V_OUT = (V_OUTMAX – V_OUTMIN) x 10⁶
V_OUT x T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to I_LMAX at V_IN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T_A, T_J, _JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: Apply for Junction Temperatures of -40°C to +85°C.
8: The minimum V_IN has to justify the conditions: V_IN  V_R + V_DROPOUT and V_IN  2.7V for I_L = 0.1mA to I_OUTMAX.
DS21368C-page 2
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