DSPIC30F6011A_05 Datasheet, PDF (178/238 Pages) Microchip Technology – High-Performance Digital Signal Controllers

dsPIC30F6011A/6012A/6013A/6014A
TABLE 23-2: THERMAL OPERATING CONDITIONS
Rating
dsPIC30F601xA-30I
Operating Junction Temperature Range
Operating Ambient Temperature Range
dsPIC30F601xA-20I
Operating Junction Temperature Range
Operating Ambient Temperature Range
dsPIC30F601xA-20E
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
P_INT = V_DD × (I_DD –_∑ I_OH)
I/O Pin power dissipation:
P_I/O = _∑ ({V_DD – V_OH} × I_OH ) + _∑ (V_OL × I _OL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
T_J
-40
T_A
-40
T_J
-40
T_A
-40
T_J
-40
T_A
-40
+125
°C
+85
°C
+150
°C
+85
°C
+150
°C
+125
°C
P_D
P_INT + P_I/O
W
PDMAX
(T_J - T_A) / θ_JA
W
TABLE 23-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
θ_JA
34
°C/W
1
Package Thermal Resistance, 64-pin TQFP (14x14x1mm)
θ_JA
34
°C/W
1
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
θ_JA
39
°C/W
1
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
θ_JA
39
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-ja (θ_JA) numbers are achieved by package simulations.
TABLE 23-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
No.
Symbol
Characteristic
Min Typ⁽¹⁾ Max Units
Conditions
Operating Voltage⁽²⁾
DC10 VDD
Supply Voltage
2.5
— 5.5 V Industrial temperature
DC11 VDD
DC12 VDR
Supply Voltage
3.0
RAM Data Retention Voltage⁽³⁾ —
— 5.5 V Extended temperature
1.5 — V
DC16 VPOR
VDD Start Voltage
to ensure internal
Power-on Reset signal
—
VSS —
V
DC17 SVDD
VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05
V/ms 0-5V in 0.1 sec
0-3V in 60 ms
Note 1:
2:
3:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which VDD can be lowered without losing RAM data.
DS70143B-page 176
Preliminary
© 2005 Microchip Technology Inc.