PIC16C54C-04-P Datasheet, PDF (175/192 Pages) Microchip Technology – EPROM/ROM-Based 8-bit CMOS Microcontroller Series

PIC16C5X
28-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1

E
A
A2
c
L

A1
eB
B1
B
p
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
n
28
28
Pitch
p
.100
2.54
Top to Seating Plane
A
.160
.175
.190
4.06
4.45
Molded Package Thickness
A2
.140
.150
.160
3.56
3.81
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.595
.600
.625
15.11
15.24
Molded Package Width
E1
.505
.545
.560
12.83
13.84
Overall Length
D
1.395
1.430
1.465
35.43
36.32
Tip to Seating Plane
L
.120
.130
.135
3.05
3.30
Lead Thickness
c
.008
.012
.015
0.20
0.29
Upper Lead Width
B1
.030
.050
.070
0.76
1.27
Lower Lead Width
B
.014
.018
.022
0.36
0.46
Overall Row Spacing
§
eB
.620
.650
.680
15.75
16.51
Mold Draft Angle Top

5
10
15
5
10
Mold Draft Angle Bottom

5
10
15
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-079
MAX
4.83
4.06
15.88
14.22
37.21
3.43
0.38
1.78
0.56
17.27
15
15
 1997-2013 Microchip Technology Inc.
Preliminary
DS30453E-page 175