DSPIC30F6011A_11 Datasheet, PDF (174/234 Pages) Microchip Technology – High-Performance 16-bit Digital Signal Controllers

dsPIC30F6011A/6012A/6013A/6014A
23.1 DC Characteristics
TABLE 23-1: OPERATING MIPS VS. VOLTAGE
VDD Range
Temp Range
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
Max MIPS
dsPIC30F601XA-30I
dsPIC30F601XA-20E
30
—
—
20
15
—
—
10
10
—
TABLE 23-2: THERMAL OPERATING CONDITIONS
Rating
dsPIC30F601xA-30I
Operating Junction Temperature Range
Operating Ambient Temperature Range
dsPIC30F601xA-20E
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
P_INT = V_DD × (I_DD –_∑ I_OH)
I/O Pin power dissipation:
P_I/O = _∑({V_DD – V_OH}× I_OH ) + _∑ (V_OL × I _OL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
T_J
-40
—
+125
°C
T_A
-40
—
+85
°C
T_J
-40
—
+150
°C
T_A
-40
—
+125
°C
P_D
P_INT + P_I/O
W
PDMAX
(T_J - T_A)/θ_JA
W
TABLE 23-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
θ_JA
34
—
°C/W
1
Package Thermal Resistance, 64-pin TQFP (14x14x1mm)
θ_JA
34
—
°C/W
1
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
θ_JA
39
—
°C/W
1
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
θ_JA
39
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-ja (θ_JA) numbers are achieved by package simulations.
DS70143E-page 174
© 2011 Microchip Technology Inc.