93AA56A_07 Datasheet, PDF (17/28 Pages) Microchip Technology – 2K Microwire Compatible Serial EEPROM

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1 23
D
E
A
A2
A1
L
c
e
b1
eB
b
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
.100 BSC
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
–
–
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
.430
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
DS21794E-page 17