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TC4424AVOA Datasheet, PDF (13/22 Pages) Microchip Technology – 3A Dual High-Speed Power MOSFET Drivers | |||
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TC4423A/TC4424A/TC4425A
8-Lead Plastic Dual In-Line (PA) â 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1 23
D
E
A
A2
A1
L
c
e
b1
eB
b
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
.100 BSC
Top to Seating Plane
A
â
â
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
â
â
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.060
.070
Lower Lead Width
b
.014
.018
.022
Notes:
Overall Row Spacing §
eB
â
â
.430
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
DS21998B-page 13
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