TC429_13 Datasheet, PDF (13/20 Pages) Microchip Technology – 6A Single High-Speed, CMOS Power MOSFET Driver

TC429
8-Lead Ceramic Dual In-line – 300 mil (CERDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
2
n
1
D
E
A
c
eB
B1
A1
B
A2
L
p
Units
Dimension Limits
Number of Pins
n
Pitch
p
Top to Seating Plane
A
Standoff §
A1
Shoulder to Shoulder Width
E
Ceramic Pkg. Width
E1
Overall Length
D
Tip to Seating Plane
L
Lead Thickness
c
Upper Lead Width
B1
Lower Lead Width
B
Overall Row Spacing
eB
*Controlling Parameter
JEDEC Equivalent: MS-030
Drawing No. C04-010
MIN
.160
.020
.290
.230
.370
.125
.008
.045
.016
.320
INCHES*
NOM
8
.100
.180
.030
.305
.265
.385
.163
.012
.055
.018
.360
MAX
.200
.040
.320
.300
.400
.200
.015
.065
.020
.400
MILLIMETERS
MIN
NOM
8
2.54
4.06
4.57
0.51
0.77
7.37
7.75
5.84
6.73
9.40
9.78
3.18
4.13
0.20
0.29
1.14
1.40
0.41
0.46
8.13
9.15
MAX
5.08
1.02
8.13
7.62
10.16
5.08
0.38
1.65
0.51
10.16
 2002-2012 Microchip Technology Inc.
DS21416D-page 13