MIC5202 Datasheet, PDF (13/22 Pages) Micrel Semiconductor – Dual 100mA Low-Dropout Voltage Regulator Preliminary Information

5.0 THERMAL CONSIDERATIONS
5.1 Layout
The MIC5202 (8-pin SOIC package) has the thermal
characteristics shown in Table 5-1, when mounted on a
single-layer copper-clad printed circuit board.
TABLE 5-1:
THERMAL CHARACTERISTIC
CONSIDERATIONS
PC Board Dielectric
FR4
Ceramic
θ_JA
160°C/W
120°C/W
Multi-layer boards with a dedicated ground plane, wide
traces, and large supply bus lines provide better
thermal conductivity.
The “worst case” value of 160°C/W assumes no ground
plane, minimum trace widths, and a FR4 material
board.
5.2 Nominal Power Dissipation and
Die Temperature
At +25°C ambient temperature, the MIC5202 operates
reliably at up to 625 mW when mounted in the “worst
case” manner described in the previous section. At an
ambient temperature of +55°C, the device can safely
dissipate 440 mW. These power levels are equivalent
to a die temperature of +125°C, which corresponds to
the recommended maximum temperature for
non-military grade silicon integrated circuits.
MIC5202
 2016 Microchip Technology Inc.
DS20005614A-page 13