MIC5200 Datasheet, PDF (13/24 Pages) Micrel Semiconductor – 100mA Low-Dropout Voltage Regulator Preliminary Information

5.0 THERMAL CONSIDERATIONS
5.1 Layout
The MIC5200-x.xYM (8-pin surface mount package)
has the following thermal characteristics when
mounted on a single-layer copper-clad printed circuit
board.
PC Board Dielectric
FR4
_JA
160 °C/W
Ceramic
120 °C/W
Multi-layer boards having a ground plane, wide traces
near the pads, and large supply bus lines provide better
thermal conductivity.
The "worst case" value of 160 °C/W assumes no
ground plane, minimum trace widths, and a FR4
material board.
5.2 Nominal Power Dissipation and
Die Temperature
The MIC5200-x.xYM at a 25°C ambient temperature
will operate reliably at up to 625 mW power dissipation
when mounted in the "worst case" manner described
above. At an ambient temperature of 55°C, the device
may safely dissipate 440 mW. These power levels are
equivalent to a die temperature of 125°C, the
recommended maximum temperature for non-military
grade silicon integrated circuits.
For MIC5200-x.xYS (SOT-223 package) heat sink
characteristics, please refer to Application Hint 17,
“Calculating P.C. Board Heat Sink Area for Surface
Mount Packages”.
MIC5200
 2016 Microchip Technology Inc.
DS20005578A-page 13