TC1412_15 Datasheet, PDF (12/24 Pages) Microchip Technology – 2A High-Speed MOSFET Drivers

TC1412/TC1412N
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1RWH For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DATUM A
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
b
e
2
e
b
e
2
e
Units
Dimension Limits MIN
Number of Pins
N
Pitch
e
Top to Seating Plane
A
-
Molded Package Thickness
A2
.115
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
Molded Package Width
E1
.240
Overall Length
D
.348
Tip to Seating Plane
L
.115
Lead Thickness
c
.008
Upper Lead Width
b1
.040
Lower Lead Width
b
.014
Overall Row Spacing
§
eB
-
INCHES
NOM
8
.100 BSC
-
.130
-
.310
.250
.365
.130
.010
.060
.018
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
MAX
.210
.195
-
.325
.280
.400
.150
.015
.070
.022
.430
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
DS20001391E-page 12
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