TC1412_13 Datasheet, PDF (12/18 Pages) Microchip Technology – 2A High-Speed MOSFET Drivers

TC1412/TC1412N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
B
n
D
2
1
c
(F )
A
A2
A1
L
U nits
INC HE S
MILLIME TE R S *
Number of P ins
P itch
Dimens ion Limits
n
p
MIN
NOM
MAX
8
.026 BS C
MIN
NOM
8
0.65 BS C
Overall Height
A
-
-
.043
-
-
Molded P ackage T hicknes s
A2
.030
.033
.037
0.75
0.85
S tandoff
A1
.000
-
.006
0.00
-
Overall Width
E
.193 BS C
4.90 BS C
Molded P ackage Width
E1
.118 BS C
3.00 BS C
Overall Length
D
.118 BS C
3.00 BS C
F oot Length
L
.016
.024
.031
0.40
0.60
F ootprint (R eference)
F
.037 R E F
0.95 R E F
F oot Angle
Lead T hicknes s
0˚
-
8˚
0˚
-
c
.003
.006
.009
0.08
-
Lead Width
B
.009
.012
.016
0.22
-
Mold Draft Angle T op
5˚
-
15˚
5˚
-
Mold Draft Angle B ottom
5˚
-
15˚
5˚
-
*C ontrolling P arameter
Notes :
Dimens ions D and E 1 do not include mold flas h or protrus ions . Mold flas h or protrus ions s hall not
exceed .010" (0.254mm) per s ide.
J E DE C E quivalent: MO-187
Drawing No. C 04-111
MAX
1.10
0.95
0.15
0.80
8˚
0.23
0.40
15˚
15˚
DS21391D-page 12
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