DSC61XX Datasheet, PDF (12/26 Pages) Microchip Technology – Ultra-Small, Ultra-Low Power MEMS Oscillator

DSC61XX
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits MIN
NOM
MAX
Number of Terminals
Terminal Pitch
N
4
e
1.20 BSC
Terminal Pitch
e1
0.75 BSC
Overall Height
A
0.79
0.84
0.89
Standoff
A1
Substrate Thickness (with Terminals) A3
0.00
0.02
0.05
0.20 REF
Overall Length
D
1.60 BSC
Overall Width
E
1.20 BSC
Terminal Width
b1
0.25
0.30
0.35
Terminal Width
b2 0.325
0.375
0.425
Terminal Length
L
0.30
0.35
0.40
Notes:
Terminal 1 Index Chamfer
CH
-
0.125
-
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1199A Sheet 2 of 2
DS20005624A-page 12
 2016 Microchip Technology Inc.