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TC2185-50VCTTR Datasheet, PDF (11/20 Pages) Microchip Technology – 50 mA, 100 mA, 150 mA CMOS LDOs with | |||
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5.0 THERMAL CONSIDERATIONS
5.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the regula-
tor off when the die temperature exceeds approxi-
mately 160°C. The regulator remains off until the die
temperature cools to approximatley 150°C.
5.2 Power Dissipation
The amount of power the regulator dissipates is prima-
rily a function of input voltage, output voltage and
output current.
The following equation is used to calculate worst-case
power dissipation.
EQUATION 5-1:
PD â (VINMAX â VOUTMIN)ILMAX
Where:
PD
= Worst-case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILMAX = Maximum output (load) current
The maximum allowable power dissipation (PDMAX) is
a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) (+125°C) and the thermal resistance from junc-
tion-to-air (θJA). The 5-Pin SOT-23A package has a θJA
of approximately 220°C/Watt when mounted on a
typical two-layer FR4 dielectric copper-clad PC board.
EQUATION 5-2:
PDMAX = T----J--M-----A---X--θ--â-J---A-T---A----M----A---X-
Where all terms are previously defined.
TC2014/2015/2185
The PD equation can be used in conjunction with the
PDMAX equation to ensure that regulator thermal
operation is within limits. For example:
Given:
VINMAX
VOUTMIN
ILOADMAX
TJMAX
TAMAX
= 3.0V +10%
= 2.7V â 2.5%
= 40 mA
= +125°C
= +55°C
Find:
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD = (VINMAX â VOUTMIN)ILMAX
= [(3.0 Ã 1.1) â (2.7 Ã 0.975)]40 Ã 10â3
= 26.7mW
Maximum allowable power dissipation:
PDMAX
=
T----J--M-----A---X----â-----T---A----M----A---X-
θJA
= 1---2---5-----â-----5--5--
220
= 318mW
In this example, the TC2014 dissipates a maximum of
only 26.7 mW; far below the allowable limit of 318 mW.
In a similar manner, the PD and PDMAX equations can
be used to calculate maximum current and/or input
voltage limits.
5.3 Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads and wide power
supply bus lines combine to lower θJA and, therefore,
increase the maximum allowable power dissipation
limit.
© 2006 Microchip Technology Inc.
DS21662E-page 11
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