MIC24053 Datasheet, PDF (11/32 Pages) Micrel Semiconductor – 12V, 9A High-Efficiency Buck Regulator

100
95
90
85
80
75
70
65
60
55
50
0
V_IN = 5V
3
6
9
OUTPUT CURRENT (A)
3.3V
2.5V
1.8V
1.5V
1.2V
1.0V
0.9V
0.8V
12
FIGURE 2-25:
Output Current.
Efficiency (V_IN = 5V) vs.
4.0
3.5 VIN = 5V
3.0
2.5
2.0
V_OUT = 3.3V
1.5
1.0
V_OUT = 0.8V
0.5
0.0
0
1.5
3
4.5
6
7.5
9
OUTPUT CURRENT (A)
FIGURE 2-26:
IC Power Dissipation
(V_IN = 5V) vs. Output Current.
100
80
60
40
20
VIN = 5V
V_OUT = 1.8V
0
0
1.5
3
4.5
6
7.5
9
OUTPUT CURRENT (A)
FIGURE 2-27:
Die Temperature (V_IN = 5V)
vs. Output Current (Note 1).
MIC24053
100
95
5.0V
90
3.3V
2.5V
85
1.8V
1.5V
80
1.2V
75
1.0V
0.9V
70
0.8V
65
60
55
50
0
VIN = 12V
2
4
6
8
10
12
OUTPUT CURRENT (A)
FIGURE 2-28:
Output Current.
Efficiency (V_IN = 12V) vs.
4.0
VIN = 12V
3.5
3.0
2.5
VOUT = 5V
2.0
1.5
1.0
VOUT = 0.8V
0.5
0.0
0
1.5
3
4.5
6
7.5
9
OUTPUT CURRENT (A)
FIGURE 2-29:
IC Power Dissipation
(V_IN = 12V) vs. Output Current.
14
12
0.8V
10
8
1.5V
6
4
VIN = 5V
2 ^{VOUT = 0.8, 1.2, 1.5V}
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
FIGURE 2-30:
Thermal Derating vs.
Ambient Temperature (Note 1).
Note 1: Die Temperature: The temperature measurement was taken at the hottest point on the MIC24053 case
mounted on a 5in², 4 layer, 0.62”, FR-4 PCB with 2oz finish copper weight per layer; see the Thermal Mea-
surements section. Actual results depend on the size of the PCB, ambient temperature, and proximity to
other heat-emitting components.
 2015 Microchip Technology Inc.
DS20005668A-page 11