TC1265_06 Datasheet, PDF (10/18 Pages) Microchip Technology – 800 mA Fixed-Output CMOS LDO with Shutdown

TC1265
5-Lead Plastic (ET) (DDPAK) )
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
L3
E1
D2
D
D1
1
b
e
TOP VIEW
A
Φ
A1
c
BOTTOM VIEW
L
α
(5X)
c2
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
5
e
.067 BSC
5
1.70 BSC
Overall Height
A
.170
.177
.183
4.32
4.50
4.65
Standoff
§
A1
.000
.005
.010
0.00
0.13
0.25
Overall Width
E
.385
.398
.410
9.78
10.11
10.41
Exposed Pad Width
E1
.256 REF
6.50 REF
Molded Package Length
D
.330
.350
.370
8.38
8.89
9.40
Overall Length
D1
.549
.577
.605
13.94
14.66
15.37
Exposed Pad Length
Lead Thickness
D2
.303 REF
7.75 REF
c
.014
.020
.026
0.36
0.51
0.66
Pad Thickness
c2
.045
--
.055
1.14
--
1.40
Lead Width
b
.026
.032
.037
0.66
0.81
0.94
Foot Length
L
.068
.089
.110
1.73
2.26
2.79
Pad Length
L3
.045
--
.067
1.14
--
1.70
Foot Angle
Mold Draft Angle
Φ
--
--
8°
--
--
8°
α
3°
--
7°
3°
--
7°
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: TO-252
Drawing No. C04-012
Revised 07-19-05
DS21376D-page 10
© 2006 Microchip Technology Inc.