TC4403_13 Datasheet, PDF (1/16 Pages) Microchip Technology – 1.5A High-Speed, Floating Load Driver

TC4403
1.5A High-Speed, Floating Load Driver
Features
• Low Quiescent Current: 300A Max
• Capacitive Inputs With 300mV Hysteresis
• Both Inputs Must Be Driven to Drive Load
• Low Output Leakage
• High Peak Current Capability
• Fast Output Rise Time
• Outputs Individually Testable
Applications
• Isolated Load Drivers
• Pulsers
• Safety Interlocks
Device Selection Table
Part Number
TC4403CPA
TC4403EPA
TC4403MJA
Package
8-Pin PDIP
8-Pin PDIP
8-Pin CERDIP
Temp. Range
0°C to +70°C
-40°C to +85°C
-55°C to +125°C
Package Type
8-Pin PDIP/CERDIP
NC 1
IN (V_DD) 2
GND 3
IN (GND) 4
TC4403
8 NC
7 OUT (V_DD)
6 V_DD
5 OUT (GND)
General Description
The TC4403 is a modified version of the TC4425 driver,
intended to drive floating or isolated loads requiring
high-current pulses. The load is intended to be con-
nected between the outputs without other reference to
supply or ground. Then, only when both logic inputs
and the V_DD input are energized, is power supplied to
the load. This construction allows the implementation
of a wide variety of redundant input controllers.
The low OFF-state output leakage and independence
of the two half-circuits permit a wide variety of testing
schemes to be utilized to assure functionality. The high
peak current capability, short internal delays, and fast
output rise and fall times ensure that sufficient power
will be available to the load when it is needed. The TTL
and CMOS compatible inputs allow operation from a
wide variety of input devices. The ability to swing the
inputs negative without affecting device performance
allows negative biases to be placed on the inputs for
greater safety. In addition, the capacitive nature of the
inputs allows the use of series resistors on the inputs
for extra noise suppression.
The TC4403 is built for outstanding ruggedness and
reliability in harsh applications. Input voltage excur-
sions above the supply voltage or below ground are
clamped internally without damaging the device. The
output stages are power MOSFETs with high-speed
body diodes to prevent damage to the driver from
inductive kickbacks.
 2002-2012 Microchip Technology Inc.
DS21417C-page 1