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SST12LP19E Datasheet, PDF (1/23 Pages) Microchip Technology – 2.4 GHz High-Power, High-Gain Power Amplifier
2.4 GHz High-Power, High-Gain Power Amplifier
SST12LP19E
Data Sheet
SST12LP19E is a versatile power amplifier based on the highly-reliable InGaP/
GaAs HBT technology. SST12LP19E is a 2.4 GHz fully-integrated, high-power,
high-gain Power Amplifier module designed in compliance with IEEE 802.11b/g/n
applications. It typically provides 25 dB gain with 34% power-added efficiency.
SST12LP19E has excellent linearity while meeting 802.11g spectrum mask at 23.5
dBm and 802.11b spectrum mask at 23 dBm. This power amplifier includes a power
detector with dB-wise linear voltage output and features easy board-level usage
along with high-speed power-up/down control through a single combined reference
voltage pin. SST12LP19E and is offered in 6-contact XSON, 8-contact XSON, and
6-contact X2SON packages.
Features
• Excellent RF Stability with Moderate Gain:
– Typically 25 dB gain across 2.4 – 2.5 GHz
• High linear output power:
– >26 dBm P1dB
- Please refer to “Absolute Maximum Stress Ratings” on
page 6
– Meets 802.11g OFDM ACPR requirement up to 23.5
dBm
– ~2.5% added EVM up to 18 dBm (high-efficiency con-
figuration) or ~3% added EVM up to 19.5 dBm (high-
power configuration) for 54 Mbps 802.11g signal
– Meets 802.11b ACPR requirement up to 23 dBm
• High power-added efficiency/Low operating cur-
rent for 802.11b/g/n applications
– ~34%/200 mA @ POUT = 23.5 dBm for 802.11g
– ~31%/195 mA @ POUT = 23 dBm for 802.11b
• Single-pin low IREF power-up/down control
– IREF <2 mA
• Low idle current
– ~40-65 mA ICQ, depending on package type and config-
uration.
• High-speed power-up/down
– Turn on/off time (10%- 90%) <100 ns
– Typical power-up/down delay with driver delay included
<200 ns
• Low Shut-down Current (~2 µA)
• High temperature stability
– ~1 dB gain/power variation between 0°C to +85°C
• Excellent On-chip power detection
– 20 dB dynamic range on-chip power detection
– dB-wise linear output voltage
– Temperature stable and load insensitive
• Simple input/output matching
• Packages available
– 8-contact XSON – 2mm x 2mm x 0.5 mm max
– 6-contact XSON – 1.5mm x 1.5mm x 0.5 mm max
– 6-contact X2SON – 1.5mm x 1.5mm x 0.4mm max
• All non-Pb (lead-free) devices are RoHS compliant
Applications
• WLAN (IEEE 802.11b/g/n)
• Home RF
• Cordless phones
• 2.4 GHz ISM wireless equipment
©2013 Silicon Storage Technology, Inc.
www.microchip.com
DS70005041C
05/13