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SST12LP15B Datasheet, PDF (1/28 Pages) Microchip Technology – 2.4 GHz WLAN 802.11b,g,n, 256 QAM Power Amplifier | |||
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2.4 GHz WLAN 802.11b,g,n, 256 QAM Power Amplifier
SST12LP15B
Data Sheet
SST12LP15B is a versatile power amplifier based on the highly-reliable InGaP/
GaAs HBT technology. Easily configured for high-linear operation meeting the
EVM requirements for 256 QAM applications, and for high-efficiency applications
with excellent power-added efficiency while operating over the 2.4- 2.5 GHz fre-
quency band. Configured for high efficiency, SST12LP15B will typically meet the
802.11g spectrum mask at 23 dBm with 270 mA. Configured for high linearity,
SST12LP15B will provide less than 2.5% EVM, up to 20 dBm, with MCS7-HT40
modulation, and less than 1.75% EVM, up to 18 dBm, with MCS9-VHT40 modula-
tion. This power amplifier also features easy board-level usage along with high-
speed power-up/down control through the reference voltage pins. The
SST12LP15B is offered in both a 3mm x 3mm, 16-contact VQFN package and a
2mm x 2mm, 12-contact XQFN package.
Features
⢠High Gain:
â More than 32 dB gain across 2.4â2.5 GHz over tempera-
ture -40°C to +85°C
⢠Configured for High Linearity
â 20 dBm at 2.5% DEVM, MCS7-HT40, 200mA
â 18 dBm at 1.8% DEVM, MCS9-VHT40, 180 mA
â 23 dBm typical spectrum mask compliance, MCS0-20
⢠Configured for High Efficiency
â 23 dBm at 3% DEVM, 802.11g OFDM 54 Mbps, 310mA
â 25.5 dBm typical spectrum mask compliance, 802.11b,
1Mbps
â >29 dBm P1dB
â Meets 802.11g OFDM ACPR requirement up to 26 dBm
⢠High power-added efficiency/Low operating current
⢠Low IREF current for power-up/down control
â IREF <2 mA
⢠High-speed power-up/down
â Turn on/off time (10%- 90%) <100 ns
â Typical power-up/down delay with driver delay included
<200 ns
⢠Low Shut-down Current:2µA
⢠High temperature stability
â Typically 1 dB gain/power variation between 0°C to
+85°C
⢠Excellent On-chip power detection
â 20 dB linear dynamic range
â Temperature- and VSWR-insensitive
⢠Simple input/output matching
⢠Packages available
â 16-contact VQFN â 3mm x 3mm
â 12-contact XQFN â 2mm x 2mm
⢠All non-Pb (lead-free) devices are RoHS compliant
Applications
⢠WLAN (IEEE 802.11b/g/n/256 QAM)
⢠Cordless phones
⢠2.4 GHz ISM wireless equipment
©2014 Silicon Storage Technology, Inc.
www.microchip.com
DS70005029C
07/15
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