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SST12LF02_15 Datasheet, PDF (1/17 Pages) Microchip Technology – 2.4 GHz WLAN High-Gain, High-Efficiency FEM
2.4 GHz WLAN High-Gain, High-Efficiency FEM
SST12LF02
Data Sheet
SST12LF02 is a 2.4 GHz Front-End Module (FEM) that combines a high-perfor-
mance Power Amplifier (PA) and a single-pole, three-throw, antenna switch for Tx/
Rx and Bluetooth® control. Designed in compliance with IEEE 802.11 b/g/n/256
QAM applications and based on GaAs PHEMT/HBT technology, the SST12LF02
operates within the frequency range of 2.4- 2.5 GHz at a very low DC-current con-
sumption. The Transmitter chain has excellent linearity, typically 3% EVM up to 18
dBm output power, for 54 Mbps 802.11g operation while meeting 802.11g spec-
trum mask at 21 dBm. The transmitter will also provide 17 dBm with 11n, MCS7-
HT40 modulation and 16 dBm with 256 QAM MCS9-HT40 modulation.
SST12LF02 is offered in a 16-contact XQFN package.
Features
• High gain:
– Typically 29 dB gain across 2.4–2.5 GHz over tempera-
ture 0°C to +85°C for Transmitter (TX) chain.
• High linear output power:
– >24 dBm P1dB
- Single-tone measurement
- Please refer to “Absolute Maximum Stress Ratings” on
page 6
– Meets 802.11g OFDM ACPR requirement up to 21 dBm
– ~3% EVM up to 18 dBm for
54 Mbps 802.11g signal
– Meets 802.11b ACPR requirement up to 21 dBm
– 2.5% EVM up to 17 dBm for 11n, MCS7-HT40
– 1.8% EVM up to 16 dBm for 256 QAM MCS9-HT40
• High power-added efficiency/Low operating cur-
rent for 802.11b/g/n applications
– ~27%/160 mA @ POUT = 21 dBm for 802.11g
– ~26%/165 mA @ POUT = 21 dBm for 802.11b
• Low IREF power-up/down control
– IREF <2 mA
• Low idle current
– ~65 mA ICQ for 11g operation
– ~80 mA ICQ for 11n and 256 QAM operation
• High-speed power-up/down
– Turn on/off time (10%- 90%) <100 ns
– Typical power-up/down delay with driver delay included
<200 ns
• Low shut-down current (~2 µA)
• Limited variation over temperature
– ~1 dB gain/power variation between 0°C to +85°C
• Excellent on-chip power detection
– >15 dB dynamic range on-chip power detection
• Input/output ports matched to 50 internally and
DC decoupled.
• Packages available
– 16-contact XQFN – 3mm x 3mm
• All non-Pb (lead-free) devices are RoHS compliant
Applications
• WLAN (IEEE 802.11b/g/n)
• Cordless phones
• 2.4 GHz ISM wireless equipment
© 2015
www.microchip.com
DS-70005001D
01/15
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