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MTD6502B Datasheet, PDF (1/20 Pages) Microchip Technology – 5V 3-Phase BLDC Sinusoidal Sensorless Fan Motor Driver | |||
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MTD6502B
5V 3-Phase BLDC Sinusoidal Sensorless Fan Motor Driver
Features:
⢠Position Sensorless BLDC Drivers
(No Hall Sensor Required)
⢠180° Sinusoidal Drive, for High Efficiency and Low
Acoustic Noise
⢠Support 2V to 5.5V Power Supplies
⢠Direction Control:
- Forward direction: connect DIR pin to GND or
leave floating
- Reverse direction: connect DIR pin to VDD
⢠Speed Control through Power Supply Modulation
(PSM) and/or Pulse-Width Modulation (PWM)
⢠Built-in Frequency Generator (FG Output Signal)
⢠Built-in Lock-up Protection and Automatic
Recovery Circuit (External Capacitor not
Necessary)
⢠Built-in Over Current Limitation
⢠Built-in Thermal Shutdown Protection
⢠No External Tuning Required
⢠Available Packages:
- 3 mm x 3 mm TDFN-10
Applications:
⢠Notebook CPU Cooling Fans
⢠5V 3-Phase Brushless DC Motors
Description:
The MTD6502B device is a 3-phase full-wave driver for
brushless sensorless DC motors. It features 180°
sinusoidal drive, high torque output and silent drive.
With adaptive features, parameters and a wide range
of power-supplies (2V to 5.5V), the MTD6502B device
is intended to cover a wide range of motor
characteristics, while requiring minimum external com-
ponents. Speed control can be achieved through either
power supply modulation or pulse-width modulation
(using the PWM digital input pin).
With the compact packaging and minimum bill-of-
material (integrated power transistors, no Hall sensor,
no external tuning), the MTD6502B is best suited for
low-cost fan applications requiring high efficiency and
low acoustic noise, such as notebook CPU cooling
fans. Frequency generator (FG) output enables the
precision speed control in closed-loop applications.
The MTD6502B driver includes a lock-up protection
mode, which turns off the output current when the
motor is under lock condition, and an automatic recov-
ery that enables the fan to run when the lock condition
is removed. The motor overcurrent limitation and ther-
mal-shutdown protection are included for safety-
enhanced operations.
The MTD6502B is available in a compact thermally-
enhanced 3 mm x 3 mm TDFN package.
Package Types
MTD6502B
3x3 TDFN*
FG 1
GND 2
VDD 3
OUT1 4
OUT2 5
10 PWM
9 DIR
EP
11
8 VCC
7 OUT3
6 GND
* Includes Exposed Thermal Pad (EP); see Table 2-1.
ï£ 2011 Microchip Technology Inc.
DS25003A-page 1
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