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MCP6V61 Datasheet, PDF (1/46 Pages) Microchip Technology – Portable Instrumentation | |||
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MCP6V61/1U/2/4
80 µA, 1 MHz Zero-Drift Op Amps
Features
⢠High DC Precision:
- VOS Drift: ±15 nV/°C (maximum, VDD = 5.5V)
- VOS: ±8 µV (maximum)
- AOL: 125 dB (minimum, VDD = 5.5V)
- PSRR: 117 dB (minimum, VDD = 5.5V)
- CMRR: 120 dB (minimum, VDD = 5.5V)
- Eni: 0.54 µVP-P (typical), f = 0.1 Hz to 10 Hz
- Eni: 0.17 µVP-P (typical), f = 0.01 Hz to 1 Hz
⢠Enhanced EMI Protection:
- Electromagnetic Interference Rejection Ratio
(EMIRR) at 1.8 GHz: 101 dB
⢠Low Power and Supply Voltages:
- IQ: 80 µA/amplifier (typical)
- Wide Supply Voltage Range: 1.8V to 5.5V
⢠Small Packages:
- Singles in SC70, SOT-23
- Duals in MSOP-8, 2x3 TDFN
- Quads in TSSOP-14
⢠Easy to Use:
- Rail-to-Rail Input/Output
- Gain Bandwidth Product: 1 MHz (typical)
- Unity Gain Stable
⢠Extended Temperature Range: -40°C to +125°C
Typical Applications
⢠Portable Instrumentation
⢠Sensor Conditioning
⢠Temperature Measurement
⢠DC Offset Correction
⢠Medical Instrumentation
Design Aids
⢠SPICE Macro Models
⢠FilterLab® Software
⢠Microchip Advanced Part Selector (MAPS)
⢠Analog Demonstration and Evaluation Boards
⢠Application Notes
Related Parts
⢠MCP6V11/1U/2/4: Zero-Drift, Low Power
⢠MCP6V31/1U/2/4: Zero-Drift, Low Power
⢠MCP6V71/1U/2/4: Zero-Drift, 2 MHz
⢠MCP6V81/1U: Zero-Drift, 5 MHz
⢠MCP6V91/1U: Zero-Drift, 10 MHz
General Description
The Microchip Technology Inc. MCP6V61/1U/2/4
family of operational amplifiers provides input offset
voltage correction for very low offset and offset drift.
These devices have a gain bandwidth product of
1 MHz (typical). They are unity-gain stable, have
virtually no 1/f noise and have good Power Supply
Rejection Ratio (PSRR) and Common Mode Rejection
Ratio (CMRR). These products operate with a single
supply voltage as low as 1.8V, while drawing
80 µA/amplifier (typical) of quiescent current.
The Microchip Technology Inc. MCP6V61/1U/2/4 op
amps are offered in single (MCP6V61 and
MCP6V61U), dual (MCP6V62) and quad (MCP6V64)
packages. They were designed using an advanced
CMOS process.
Package Types
MCP6V61
SOT-23
MCP6V62
MSOP
VOUT 1
VSS 2
VIN+ 3
5 VDD VOUTA 1
VINAâ 2
4 VINâ VINA+ 3
VSS 4
8 VDD
7 VOUTB
6 VINBâ
5 VINB+
MCP6V61U
SC70, SOT-23
MCP6V62
2Ã3 TDFN *
VIN+ 1
VSS 2
VINâ 3
5 VDD VOUTA 1
8 VDD
VINAâ 2
4 VOUT VINA+ 3
EP
9
7 VOUTB
6 VINBâ
VSS 4
5 VINB+
MCP6V64
TSSOP
VOUTA 1
VINAâ 2
VINA+ 3
VDD 4
VINB+ 5
VINBâ 6
VOUTB 7
14 VOUTD
13 VINDâ
12 VIND+
11 VSS
10 VINC+
9 VINCâ
8 VOUTC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
ï£ 2014-2015 Microchip Technology Inc.
DS20005367B-page 1
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