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MCP6H01_12 Datasheet, PDF (1/46 Pages) Microchip Technology – 1.2 MHz, 16V Op Amps
MCP6H01/2/4
1.2 MHz, 16V Op Amps
Features:
• Input Offset Voltage: ±0.7 mV (typical)
• Quiescent Current: 135 µA (typical)
• Common Mode Rejection Ratio: 100 dB (typical)
• Power Supply Rejection Ratio: 102 dB (typical)
• Rail-to-Rail Output
• Supply Voltage Range:
- Single-Supply Operation: 3.5V to 16V
- Dual-Supply Operation: ±1.75V to ±8V
• Gain Bandwidth Product: 1.2 MHz (typical)
• Slew Rate: 0.8V/µs (typical)
• Unity Gain Stable
• Extended Temperature Range: -40°C to +125°C
• No Phase Reversal
Applications:
• Automotive Power Electronics
• Industrial Control Equipment
• Battery Powered Systems
• Medical Diagnostic Instruments
Design Aids:
• SPICE Macro Models
• FilterLab® Software
• MAPS (Microchip Advanced Part Selector)
• Analog Demonstration and Evaluation Boards
• Application Notes
Typical Application
R1
V1
R2
VDD
VREF
MCP6H01
VOUT
V2
R1
R2
Difference Amplifier
Description:
Microchip’s MCP6H01/2/4 family of operational amplifi-
ers (op amps) has a wide supply voltage range of 3.5V
to 16V and rail-to-rail output operation. This family is
unity gain stable and has a gain bandwidth product of
1.2 MHz (typical). These devices operate with a
single-supply voltage as high as 16V, while only
drawing 135 µA/amplifier (typical) of quiescent current.
The MCP6H01/2/4 family is offered in single
(MCP6H01), dual (MCP6H02) and quad (MCP6H04)
configurations. All devices are fully specified in
extended temperature range from -40°C to +125°C.
Package Types
MCP6H01
SC70-5, SOT 23-5
VOUT 1
VSS 2
VIN+ 3
5 VDD
4 VIN–
MCP6H01
SOIC
NC 1
VIN– 2
VIN+ 3
VSS 4
8 NC
7 VDD
6 VOUT
5 NC
MCP6H02
SOIC
VOUTA 1
VINA– 2
VINA+ 3
VSS 4
8 VDD
7 VOUTB
6 VINB–
5 VINB+
MCP6H01
2x3 TDFN
MCP6H02
2x3 TDFN
NC 1
8 NC VOUTA 1
8 VDD
VIN– 2 EP 7 VDD VINA– 2 EP 7 VOUTB
VIN+ 3
9
6 VOUT VINA+ 3
9
6 VINB–
VSS 4
5 NC
VSS 4
5 VINB+
MCP6H04
SOIC, TSSOP
VOUTA 1
VINA– 2
VINA+ 3
VDD 4
14 VOUTD
13 VIND–
12 VIND+
11 VSS
VINB+ 5
VINB– 6
10 VINC+
9 VINC–
VOUTB 7
8 VOUTC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
 2010-2011 Microchip Technology Inc.
DS22243D-page 1