MCP6061 Datasheet, PDF (1/34 Pages) –

MCP6061/2/4
60 µA, High Precision Op Amps
Features
• Low Offset Voltage: ±150 µV (maximum)
• Low Quiescent Current: 60 µA (typical)
• Rail-to-Rail Input and Output
• Wide Supply Voltage Range: 1.8V to 6.0V
• Gain Bandwidth Product: 730 kHz (typical)
• Unity Gain Stable
• Extended Temperature Range: -40°C to +125°C
• No Phase Reversal
Applications
• Automotive
• Portable Instrumentation
• Sensor Conditioning
• Battery Powered Systems
• Medical Instrumentation
• Test Equipment
• Analog Filters
Design Aids
• SPICE Macro Models
• FilterLab^® Software
• Mindi™ Circuit Designer & Simulator
• Microchip Advanced Part Selector (MAPS)
• Analog Demonstration and Evaluation Boards
• Application Notes
Typical Application
R_L
Z_IN
MCP6061
V_OUT
C
Z_IN = R_L + jωL
R
L = R_LRC
Gyrator
Description
The Microchip Technology Inc. MCP6061/2/4 family of
operational amplifiers (op amps) has low input offset
voltage (±150 µV, maximum) and rail-to-rail input and
output operation. This family is unity gain stable and
has a gain bandwidth product of 730 kHz (typical).
These devices operate with a single supply voltage as
low as 1.8V, while drawing low quiescent current per
amplifier (60 µA, typical). These features make the
family of op amps well suited for single-supply, high
precision, battery-powered applicaitons.
The MCP6061/2/4 family is offered in single
(MCP6061), dual (MCP6062), and quad (MCP6064)
configurations.
The MCP6061/2/4 is designed with Microchip’s
advanced CMOS process. All devices are available in
the extended temperature range, with a power supply
range of 1.8V to 6.0V.
Package Types
MCP6061
SOIC
NC 1
8 ^NC
V_IN– 2
V_IN+ 3
V_SS 4
7 V_DD
6 V_OUT
5 ^NC
MCP6062
SOIC
V_OUTA 1
8 ^VDD
V_INA– 2
7 V_OUTB
V_INA+ 3
6 V_INB–
V_SS 4
5 ^VINB⁺
MCP6061
2x3 TDFN *
MCP6062
2x3 TDFN *
NC 1
8 NC V_OUTA 1
8 V_DD
V_IN– _{2 EP 7} V_DD V_INA– _{2 EP 7} V_OUTB
V_IN+ ₃
9
6 ^VOUT ^VINA⁺ 3
9
6 ^VINB^–
V_SS 4
5 NC
V_SS 4
5 V_INB+
MCP6064
SOIC, TSSOP
V_OUTA 1
V_INA– 2
V_INA+ 3
V_DD 4
14 ^VOUTD
13 V_IND–
12 V_IND+
11 ^VSS
V_INB+ 5
V_INB– 6
10 V_INC+
9 V_INC–
V_OUTB 7
8 V_OUTC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
© 2009 Microchip Technology Inc.
DS22189A-page 1