MCP39F521 Datasheet, PDF (1/52 Pages) Microchip Technology – I2C Power Monitor with Calculation and Energy Accumulation

MCP39F521
I²C Power Monitor with Calculation and Energy Accumulation
Features
• Power Monitoring Accuracy Capable of 0.1%
Error Across 4000:1 Dynamic Range
• Built-In Calculations on Fast 16-bit Processing
Core
- Active, Reactive, Apparent Power
- True Root Mean Square (RMS) Current,
RMS Voltage
- Line Frequency, Power Factor
• 64-bit Wide Import and Export Active Energy
Accumulation Registers
• 64-bit Four Quadrant Reactive Energy
Accumulation Registers
• Signed Active and Reactive Power Outputs
• Dedicated Zero Crossing Detection (ZCD) Pin
Output with Less than 100 µs Latency
• Automatic Event Pin Control through Fast Voltage
Surge Detection, Less than 5 ms Delay
• I²C Interface, up to 400 kHz Clock Rate
• Two Independent Registers for Minimum and
Maximum Output Quantity Tracking
• Fast Calibration Routines and Simplified
Command Protocol
• 512 Bytes User-Accessible EEPROM through
Page Read/Write Commands
• Low-Drift Internal Voltage Reference,
10 ppm/°C Typical
• 28-lead 5 x 5 mm QFN Package
• Extended Temperature Range -40°C to +125°C
Applications
• Power Monitoring for Home Automation
• Industrial Lighting Power Monitoring
• Real-Time Measurement of Input Power for
AC/DC Supplies
• Intelligent Power Distribution Units
Description
The MCP39F521 is a highly integrated, complete
single-phase power-monitoring device, designed for
real-time measurement of input power for AC/DC
power supplies, power distribution units, consumer and
industrial applications. It includes dual-channel
delta-sigma ADCs, a 16-bit calculation engine,
EEPROM and a flexible two-wire I²C interface.
An integrated low-drift voltage reference with
10 ppm/°C in addition to 94.5 dB of signal-to-noise and
distortion ratio (SINAD) performance on each
measurement channel allows for better than 0.1%
accurate designs across a 4000:1 dynamic range.
Package Types
MCP39F521
5x5 QFN*
28 27 26 25 24 23 22
EVENT 1
21 A_GND
NC 2
20 AN_IN
NC 3
COMMON_B 4
COMMON_{A 5}
19 V1+
EP
29
18 V1-
17 I1-
OSCI 6
16 I1+
OSCO ₇
15 A1
8 9 10 11 12 13 14
*Includes Exposed Thermal Pad (EP); see Table 3-1.
 2015 Microchip Technology Inc.
DS20005442A-page 1