MCP2561 Datasheet, PDF (1/30 Pages) Microchip Technology – High-Speed CAN Transceiver

MCP2561/2
High-Speed CAN Transceiver
Features:
• Supports 1 Mb/s Operation
• Implements ISO-11898-5 Standard Physical Layer
Requirements
• Very Low Standby Current (5 µA, typical)
• VIO Supply Pin to Interface Directly to
CAN Controllers and Microcontrollers with
1.8V to 5.5V I/O
• SPLIT Output Pin to Stabilize Common Mode in
Biased Split Termination Schemes
• CAN Bus Pins are Disconnected when Device is
Unpowered
- An Unpowered Node or Brown-Out Event will
Not Load the CAN Bus
• Detection of Ground Fault:
- Permanent Dominant Detection on TXD
- Permanent Dominant Detection on Bus
• Power-on Reset and Voltage Brown-Out
Protection on VDD and VIO Pin
• Protection Against Damage Due to Short-Circuit
Conditions (Positive or Negative Battery Voltage)
• Protection Against High-Voltage Transients in
Automotive Environments
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or exceeds stringent automotive design
requirements including “Hardware Requirements
for LIN, CAN and FlexRay Interfaces in Automo-
tive Applications”, Version 1.3, May 2012
• High-Noise Immunity Due to Differential Bus
Implementation
• High ESD Protection on CANH and CANL, Meets
IEC61000-4-2 greater ±8 kV
• Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L
• Temperature ranges:
- Extended (E): -40°C to +125°C
- High (H): -40°C to +150°C
Description:
The MCP2561/2 is a Microchip Technology Inc. second
generation high-speed CAN transceiver. It serves as an
interface between a CAN protocol controller and the
physical two-wire CAN bus.
The device meets the automotive requirements for
high-speed (up to 1 Mb/s), low quiescent current,
electromagnetic compatibility (EMC) and electrostatic
discharge (ESD).
Package Types
MCP2561
PDIP, SOIC
TXD ₁
VSS 2
VDD 3
RXD 4
8 ^STBY
7 CANH
6 CANL
5 SPLIT
MCP2562
PDIP, SOIC
TXD ₁
VSS 2
VDD 3
RXD 4
8 ^STBY
7 CANH
6 CANL
5 VIO
MCP2561
3x3 DFN*
TXD 1
8 STBY
VSS 2 _EP 7 CANH
VDD 3
9
6 CANL
RXD 4
5 SPLIT
MCP2562
3x3 DFN*
TXD 1
8 STBY
VSS 2 _EP 7 CANH
VDD 3
9
6 CANL
RXD 4
5 VIO
* Includes Exposed Thermal Pad (EP); see Table 1-2
MCP2561/2 Family Members
Device
Feature
Description
MCP2561
Split pin
Common mode stabilization
MCP2562
VIO pin
Internal level shifter on digital I/O pins
Note: For ordering information, see the “Product Identification System” section on page 27.
 2013 Microchip Technology Inc.
DS25167B-page 1