MCP2021A Datasheet, PDF (1/46 Pages) Microchip Technology – LIN Transceiver with Voltage Regulator

MCP2021A/2A
LIN Transceiver with Voltage Regulator
Features:
• The MCP2021A/2A are compliant with LIN Bus
Specifications Version 1.3, 2.1 and with SAE
J2602-2
• Support Baud Rates up to 20 kBaud
• 43V Load Dump Protected
• Maximum Continuous Input Voltage: 30V
• Wide LIN-Compliant Supply Voltage: 6.0 – 18.0V
• Extended Temperature Range: -40 to +125°C
• Interface to PIC^® MCU EUSART and Standard
USARTs
• Wake-Up on LIN Bus Activity or Local Wake Input
• Local Interconnect Network (LIN) Bus Pin:
- Internal Pull-Up Termination Resistor and
Diode for Slave Node
- Protected Against VBAT Shorts
- Protected Against Loss of Ground
- High-Current Drive
• TXD and LIN Bus Dominant Time-Out Function
• Two Low-Power Modes:
- Transmitter Off: 90 µA (typical)
- Power Down: 4.5 µA (typical)
• Output Indicating Internal Reset State (POR or
Sleep Wake)
• MCP2021A/2A On-Chip Voltage Regulator:
- Output Voltage of 5.0V or 3.3V
at 70 mA Capability with Tolerances of ±3%
Over the Temperature Range
- Internal Short Circuit Current Limit
- External Components Limited to Filter
Capacitor and Load Capacitor
• Automatic Thermal Shutdown
• High Electromagnetic Immunity (EMI), Low
Electromagnetic Emission (EME)
• Robust ESD Performance: ±15 kV for LBUS and
VBB pin (IEC61000-4-2)
• Transient Protection for LBUS and VBB Pins in
Automotive Environment (ISO7637)
• Meets Stringent Automotive Design
Requirements, including “OEM Hardware
Requirements for LIN, CAN and FlexRay
Interfaces in Automotive Applications”, Version
1.2, March 2011
• Multiple Package Options, including Small
4x4 mm DFN Package
Description:
The MCP2021A/2A provide a bidirectional, half-duplex
communication physical interface to meet the LIN bus
specification Revision 2.1 and SAE J2602-2. The
devices incorporate a voltage regulator with 5V or 3.3V
at 70 mA regulated power supply output. The devices
have been designed to meet the stringent quiescent
current requirements of the automotive industry and
will survive +43V load dump transients and double
battery jumps.
Package Types
RXD
CS/LWAKE
VREG
TXD
MCP2021A
PDIP, SOIC
1
8
2
7
3
6
4
5
FAULT/TXE
VBB
LBUS
VSS
MCP2021A
4x4 DFN
RXD 1
CS/LWAKE 2
VREG 3
TXD 4
8 FAULT/TXE
EP ^{7 VBB}
9 6 LBUS
5 VSS
MCP2022A
PDIP, SOIC, TSSOP
RXD ₁
CS/LWAKE 2
VREG
3
TXD
4
RESET ₅
NC ₆
NC ₇
14 FAULT/TXE
13 VBB
12 LBUS
11 ^VSS
10 NC
9 NC
8 NC
* Includes Exposed Thermal Pad (EP), see Table 1-2.
 2012-2014 Microchip Technology Inc.
DS20002298C-page 1