MCP2003_14 Datasheet, PDF (1/34 Pages) Microchip Technology – LIN J2602 Transceiver

MCP2003/4/3A/4A
LIN J2602 Transceiver
Features:
• The MCP2003/2003A and MCP2004/2004A are
compliant with Local Interconnect Network (LIN)
Bus Specifications 1.3, 2.0 and 2.1 and are
compliant to SAE J2602
• Support Baud Rates up to 20 kbaudwith
LIN-Compatible Output Driver
• 43V Load Dump Protected
• Very Low High Electromagnetic Immunity (EMI)
meets Stringent Original Equipment Manufactur-
ers (OEM) Requirements
• Very High Electrostatic Discharge (ESD)
Immunity:
- >20 kV on VBB (IEC 61000-4-2)
- >14 kV on LBUS (IEC 61000-4-2)
• Very High Immunity to RF Disturbances meets
Stringent OEM Requirements
• Wide Supply Voltage, 6.0V-27.0V Continuous
• Extended Temperature Range: -40 to +125°C
• Interface to PIC^® MCU EUSART and Standard
USARTs
• LIN Bus Pin:
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High current drive
• Automatic Thermal Shutdown
• Low-Power mode:
- Receiver monitoring bus and transmitter off,
( 5 µA)
Description:
This device provides a bidirectional, half-duplex
communication, physical interface to automotive and
industrial LIN systems to meet the LIN Bus
Specification Revision 2.1 and SAE J2602. The device
is short-circuit and over-temperature protected by
internal circuitry. The device has been specifically
designed to operate in the automotive operating
environment and will survive all specified transient
conditions while meeting all of the stringent quiescent
current requirements.
MCP200X family members:
• 8-pin PDIP, DFN and SOIC packages:
- MCP2003, LIN-compatible driver, with WAKE
pins, wake-up on falling edge of LBUS
- MCP2003A, LIN-compatible driver, with
WAKE pins, wake-up on rising edge of LBUS
- MCP2004, LIN-compatible driver, with
FAULT/TXE pins, wake-up on falling edge of
LBUS
- MCP2004A, LIN-compatible driver, with
FAULT/TXE pins, wake-up on rising edge of
LBUS
Package Types
MCP2003/2003A
PDIP, SOIC
MCP2004/2004A
PDIP, SOIC
RXD ₁
CS 2
WAKE 3
TXD 4
8 ^VREN
RXD ₁
7 VBB CS/WAKE ₂
6 LBUS _{FAULT/TXE 3}
5 VSS
TXD 4
8 ^VREN
7 VBB
6 LBUS
5 VSS
MCP2003/2003A
4x4 DFN*
MCP2004/2004A
4x4 DFN*
RXD 1
8 VREN
RXD 1
8 VREN
CS 2 _EP 7 VBB ^CS/WAKE 2 EP 7 ^VBB
WAKE 3
9
6 LBUS ^{FAULT/TXE 3}
9
6 LBUS
TXD 4
5 VSS
TXD 4
5 VSS
* Includes Exposed Thermal Pad (EP); see Table 1-2.
 2010-2014 Microchip Technology Inc.
DS20002230F-page 1