MCP19035_13 Datasheet, PDF (1/44 Pages) Microchip Technology – High-Speed Synchronous Buck Controller

MCP19035
High-Speed Synchronous Buck Controller
Features:
• Input Voltage Range: from 4.5V to 30V
• Targeted for Low-Voltage Power Trains with
Output Current up to 20A
• High-Speed Voltage Mode, Analog Pulse-Width
Modulation Control
• Power Good Output
• Internal Oscillator, Reference Voltage and
Overcurrent Limit Threshold for Stand-Alone
Applications.
• Multiple Switching Frequency Options (F_SW):
- 300 kHz
- 600 kHz
• Integrated Synchronous MOSFET Drivers
• Multiple Dead-Time Options
• Internal Blocking Device for Bootstrap Circuit
• Integrated Current Sense Capability for Short
Circuit Protection
• Internal Overtemperature Protection
• Under Voltage Lockout (UVLO)
• Integrated Linear Voltage Regulator
• 10-LD 3 X 3 mm DFN Package
Applications:
• Point of Loads
• Set-Top Boxes
• DSL Cable Modems
• FPGA’s/DSP’s Power Supply
• PC’s Graphic/Audio Cards
General Description
The MCP19035 is an application-optimized, high-
speed synchronous buck controller that operates from
input voltage sources up to 30V. This controller
implements a voltage-mode control architecture with a
fixed switching frequency of 300 kHz or 600 kHz. The
high-switching frequency facilitates the use of smaller
passive components, including the inductor and
input/output capacitors, allowing a compact, high-
performance power supply solution. The MCP19035
implements an adaptive anti-cross conduction scheme
to prevent shoot-through in the external power
MOSFETs. Furthermore, the MCP19035 offers multiple
dead-time options, enabling an additional degree of
optimization, allowing a higher efficiency power supply
design.
The MCP19035 controller is intended to be used for
applications providing up to 20A of output currents
across a wide input voltage range, up to 30V.
The SHDN input is used to turn the device on and off.
While turned off, the current consumption is minimized.
The MCP19035 offers a Power Good feature
(PWRGD), enabling fault detection and simplifying
sequencing.
Package Types
MCP19035
3x3 DFN*
SHDN 1
FB 2
COMP 3
V_IN 4
PWRGD ⁵
10 HDRV
9 PHASE
EP
11
8 BOOT
7 LDRV
6 ^+VCC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
 2012-2013 Microchip Technology Inc.
DS22326B-page 1