MCP1710_15 Datasheet, PDF (1/24 Pages) Microchip Technology – Ultra Low Quiescent Current LDO Regulator

MCP1710
Ultra Low Quiescent Current LDO Regulator
Features
• Ultra Low 20 nA (typical) Quiescent Current
• Ultra Low Shutdown Supply Current: 0.1 nA (typical)
• 200 mA Output Current Capability for V_R ≤ 3.5V
• 100 mA Output Current Capability for V_R  3.5V
• Input Operating Voltage Range: 2.5V to 5.5V
• Standard Output Voltages (V_R):
- 1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 3.0V, 3.3V, 4.2V
• Low Dropout Voltage: 450 mV Maximum at
200 mA
• Stable with 1.0 µF Ceramic Output Capacitor
• Overcurrent Protection
• Space-Saving, 8-Lead Plastic 2 x 2 VDFN
Applications
• Energy Harvesting
• Long Life Battery-Powered Applications
• Smart Cards
• Ultra Low Consumption “Green” Products
• Portable Electronics
Description
The MCP1710 is a 200 mA for V_R ≤ 3.5V, 100 mA for
V_R  3.5V, Low Dropout (LDO) linear regulator that
provides high-current and low-output voltages, while
maintaining an ultra low 20 nA of quiescent current
during device operation. In addition, the MCP1710 can
be shut down for an even lower 0.1 nA (typical) supply
current draw. The MCP1710 comes in eight standard,
fixed output voltage versions: 1.2V, 1.5V, 1.8V, 2V,
2.5V, 3V, 3.3V and 4.2V. The 200 mA output current
capability, combined with the low-output voltage
capability, make the MCP1710 a good choice for new
ultra long life LDO applications that have high-current
demands, but require ultra low-power consumption
during Sleep states.
The MCP1710 is stable using ceramic output
capacitors that inherently provide lower output noise,
and reduce the size and cost of the entire regulator
solution. Only 1 µF (2.2 µF recommended) of output
capacitance is needed to stabilize the LDO.
The MCP1710 device’s ultra low quiescent and
shutdown current allows it to be paired with other ultra
low-current draw devices, such as Microchip’s XLP
technology devices, for a complete ultra low-power
solution.
Package Type
MCP1710
2x2 VDFN*
GND 1
8 SHDN
V_OUT 2 _EP 7 V_IN
NC 3 ⁹ 6 FB
NC 4
5 NC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
 2012-2015 Microchip Technology Inc.
DS20005158D-page 1