MCP1710_12 Datasheet, PDF (1/26 Pages) Microchip Technology – Ultra-Low Quiescent Current LDO Regulator

MCP1710
Ultra-Low Quiescent Current LDO Regulator
Features
• Ultra-Low 20 nA (typical) Quiescent Current
• Ultra-Low Shutdown Supply Current:
0.1 nA (typical)
• 200 mA Output Current Capability for
V_OUT < 3.5V
• 100 mA Output Current Capability for
V_OUT > 3.5V
• Input Operating Voltage Range: 2.7V to 5.5V
• Standard Output Voltages:
- 1.2V, 1.8V, 2.5V, 3.3V, 4.2V
• Low-Dropout Voltage: 450 mV Maximum at
200 mA
• Stable with 1.0 µF Ceramic Output Capacitor
• Overcurrent Protection
• Space Saving, 8-Lead Plastic 2 x 2 VDFN-8
Applications
• Energy harvesting
• Long-life battery powered applications
• Smart cards
• Ultra-Low consumption “Green” products
• Portable electronics
Description
The MCP1710 is a 200 mA for V_OUT < 3.5V, 100 mA for
V_OUT > 3.5V, low dropout (LDO) linear regulator that
provides high-current and low-output voltages, while
maintaining an ultra-low 20 nA of quiescent current
during device operation. In addition, the MCP1710 can
be shut down for an even lower 0.1 nA (typical) supply
current draw. The MCP1710 comes in five standard
fixed output voltage versions: 1.2V, 1.8V, 2.5V, 3.3V
and 4.2V. The 200 mA output current capability,
combined with the low output-voltage capability, make
the MCP1710 a good choice for new ultra-long-life LDO
applications that have high current demands, but
require ultra-low power consumption during sleep
states.
The MCP1710 is stable using ceramic output
capacitors that inherently provide lower output noise
and reduce the size and cost of the entire regulator
solution. Only 1 µF (2.2 µF recommended) of output
capacitance is needed to stabilize the LDO.
The MCP1710’s ultra-low quiescent and shutdown
current allows it to be paired with other ultra-low current
draw devices, such as Microchip’s nanoWatt XLP
technology devices, for a complete ultra-low power
solution.
Package Type
MCP1710
2 x 2 DFN*
GND 1
8 SHDN
V_OUT 2 _EP 7 V_IN
GND 3 ⁹ 6 FB
GND 4
5 GND
* Includes Exposed Thermal Pad (EP); see Table 3-1.
 2012 Microchip Technology Inc.
DS25158A-page 1