MCP1406 Datasheet, PDF (1/22 Pages) Microchip Technology – 6A High-Speed Power MOSFET Drivers

MCP1406/07
6A High-Speed Power MOSFET Drivers
Features
• High Peak Output Current: 6.0A (typ.)
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability:
- 2500 pF in 20 ns
- 6800 pF in 40 ns
• Short Delay Times: 40 ns (typ.)
• Matched Rise/Fall Times
• Low Supply Current:
- With Logic ‘1’ Input – 130 µA (typ.)
- With Logic ‘0’ Input – 35 µA (typ.)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
• Logic Input Will Withstand Negative Swing Up To
5V
• Pin compatible with the TC4420/TC4429 devices
• Space-saving 8-Pin SOIC, PDIP and 8-Pin 6x5
DFN Packages
Applications
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
• Motor and Solenoid Drive
General Description
The MCP1406/07 devices are a family of
buffers/MOSFET drivers that feature a single-output
with 6A peak drive current capability, low shoot-through
current, matched rise/fall times and propagation delay
times. These devices are pin-compatible and are
improved versions of the TC4420/TC4429 MOSFET
drivers.
The MCP1406/07 MOSFET drivers can easily charge
and discharge 2500 pF gate capacitance in under
20 ns, provide low enough impedances in both the on
and off states to ensure the MOSFETs intended state
will not be affected, even by large transients. The input
to the MCP1406/07 may be driven directly from either
TTL or CMOS (3V to 18V).
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin. All
terminals are fully protect against Electrostatic
Discharge (ESD) up to 4 kV.
The MCP1406/07 single-output 6A MOSFET driver
family is offered in both surface-mount and pin-
through-hole packages with a -40°C to +125°C
temperature rating, making it useful in any wide
temperature range application.
Package Types
8-Pin PDIP/SOIC
8-Pin 6x5 DFN
V_DD 1
INPUT 2
NC 3
GND 4
8 V_DD V_DD
7 OUT OUT
6 OUT OUT
5 GND GND
V_DD
INPUT
NC
GND
V_DD V_DD
OUT OUT
OUT OUT
GND GND
Note 1: Duplicate pins must both be connected for proper operation.
2: Exposed pad of the DFN package is electrically isolated.
5-Pin TO-220
Tab is
Common
to V_DD
1 23 4 5
© 2006 Microchip Technology Inc.
DS22019A-page 1