IS1870 Datasheet, PDF (1/44 Pages) Microchip Technology – Bluetooth® Low Energy (BLE) SoC

IS1870/71
Bluetooth^® Low Energy (BLE) SoC
Features
• Bluetooth smart 4.2 Bluetooth Low-Energy (BLE)
compliant
• 256 Kbytes embedded Flash memory
• UART/SPI/I²C interface supported
• Integrated crystal oscillator, operates with 32 MHz
external crystal
• Temperature sensor supported
• Flexible GPIO pins:
- 31 GPIO pins (IS1870)
- 15 GPIO pins (IS1871)
• PWM support:
- 4-channel PWM support (IS1870)
- 1-channel PWM support (IS1871)
• 12 bits ADC (ENOB=10/8-bit) support for battery
and voltage detection. 16-channel (IS1870)/
6-channel (IS1871)
• AES-CMAC hardware engine
• Beacon support
• Low-power consumption
• Peak current: Tx 13 mA, Rx 13 mA at VBAT=3.0V,
buck power
• Compact size:
- IS1871: 4 mm x 4 mm 32QFN package
- IS1870: 6 mm x 6 mm 48QFN package
Radio Frequency (RF)/Analog Features
• ISM band: 2.402 GHz to 2.480 GHz operation
• Channels: 0-39
• Rx sensitivity: -90 dBm in BLE mode
• Tx power: +2 dBm (max)
• Received Signal Strength Indicator (RSSI) moni-
tor
Operating Conditions
• Operating voltage: 1.9V to 3.6V
• Operating temperature: -20°C to +70°C
Applications
• Internet of Things (IoT)
• Wearable, fitness, or healthcare
• Weight scale
• Proximity/Find Me services
• Payment/Security
• Digital Beacons
• Consumer appliances or home automation
• Industrial
Packages
Type
Pin Count
I/O Pins (up to)
Contact/Lead Pitch
Dimensions
Package
Note: All dimensions are in millimeters (mm) unless specified.
IS1870
48
31
0.4
6x6x0.9
QFN48
IS1871
32
16
0.4
4x4x0.9
QFN32
 2015-2016 Microchip Technology Inc.
DS60001371C-Page 1