MIC26950_11 Datasheet, PDF (9/28 Pages) Micrel Semiconductor – 12A Hyper Speed ControlTM Synchronous DC-DC Buck Regulator

Micrel, Inc.
MIC26950
Thermal Derating*
vs. Ambient Temperature
20
16
0.8V
12
1.5V
8
4 V_IN = 5V
VOUT = 0.8, 1.2, 1.5V
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
Thermal Derating*
vs. Ambient Temperature
20
16
12
3.3V
8
1.8V
4 V_IN = 5V
VOUT = 1.8, 2.5, 3.3V
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
Thermal Derating*
vs. Ambient Temperature
25
20
0.8V
15
10
1.8V
5 _{VIN = 12V}
VOUT = 0.8, 1.2, 1.8V
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
Thermal Derating*
vs. Ambient Temperature
20
16
2.5V
12
8
5V
4 _{VIN = 12V}
VOUT = 2.5, 3.3, 5V
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
Thermal Derating*
vs. Ambient Temperature
20
16
0.8V
12
8
2.5V
4 _{VIN = 24V}
VOUT = 0.8, 1.2, 2.5V
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
Die Temperature* : The temperature measurement was taken at the hottest point on the MIC26950 case mounted on a 5 square inch 4 layer, 0.62”,
FR-4 PCB with 2oz finish copper weight per layer, see Thermal Measurement section. Actual results will depend upon the size of the PCB, ambient
temperature and proximity to other heat emitting components.
July 2011
9
M9999-070111-C