MIC24052 Datasheet, PDF (9/30 Pages) Micrel Semiconductor – 12V, 6A High-Efficiency Buck Regulator

Micrel, Inc.
Typical Characteristics (Continued)
IC Power Dissipation (VIN = 12V)
vs. Output Current
3.00
2.50
VIN = 12V
2.00
V_OUT = 5.0V
1.50
Die Temperature* (VIN = 12V)
vs. Output Current
60
40
1.00
0.50
0.00
0
V_OUT = 0.8V
1
2
3
4
5
6
OUTPUT CURRENT (A)
20
0
0
VIN = 12V
V_OUT = 1.8V
1
2
3
4
5
6
OUTPUT CURRENT (A)
MIC24052
Thermal Derating*
vs. Ambient Temperature
12
10
0.8V
8
6
1.5V
4
VIN = 5V
2
VOUT = 0.8, 1.2, 1.5V
0
-50 -25 0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
Thermal Derating*
vs. Ambient Temperature
12
Thermal Derating*
vs. Ambient Temperature
12
Thermal Derating*
vs. Ambient Temperature
12
10
8
6
3.3V
4
VIN = 5V
2
VOUT = 1.8, 2.5, 3.3V
1.8V
10
8
1.8V
6
4
VIN = 12V
VOUT = 0.8, 1.2, 1.8V
2
0.8V
10
8
6
5V
4
VIN = 12V
2 ^{VOUT = 2.5, 3.3, 5V}
2.5V
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
0
-50 -25
0
25 50 75 100 125
AMBIENT TEMPERATURE (°C)
Die Temperature* : The temperature measurement was taken at the hottest point on the MIC24052 case mounted on a 5 square inch, 4 layer,
0.62 inch, FR-4 PCB with 2oz finish copper weight per layer; see Thermal Measurement section. Actual results will depend upon the size of the PCB,
ambient temperature and proximity to other heat emitting components.
December 2012
9
M9999-120312-A