SY58016L Datasheet, PDF (5/5 Pages) Micrel Semiconductor – 3.3V 10Gbps DIFFERENTIAL CML LINE DRIVER/RECEIVER WITH INTERNAL TERMINATION

Micrel
16 LEAD MicroLeadFrame™ (MLF-16)
SY58016L
3.00BSC
2.75BSC
16
1
0.50 DIA ²
3
4
0.85
+0.15
–0.65
0.65
+0.15
–0.65
2.75BSC 3.00BSC
0.01
+0.04
–0.01
0.20 REF.
0.42
+0.18
–0.18
0.42
+0.18
–0.18
0.23
+0.07
–0.05
1.60
+0.10
–0.10
PIN 1 ID
N
1
2
3
1.60
+0.10
–0.10
4
TOP VIEW
12° max
SEATING
PLANE
0.42
+0.18
–0.18
0.5 BSC
1.5 REF
0.40
+0.05
–0.05
BOTTOM VIEW
CC
CL
0.5BSC
0.23
+0.07
–0.05
4
0.01
+0.04
–0.01
SECTION "C-C"
SCALE: NONE
1. DIMENSIONS ARE IN mm.
2. DIE THICKNESS ALLOWABLE IS 0.305mm MAX.
3. PACKAGE WARPAGE MAX 0.05mm.
4. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.20mm AND 0.25mm FROM TIP.
5. APPLIES ONLY FOR TERMINALS
Package Notes:
1.
Package meets Level 2 Moisture Sensitivity Classification and is shipped in Dry-pack form.
2.
Expose pad must be soldered to a ground for proper thermal management.
Rev. 02
MICREL, INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 [phone] FAX + 1 [phone] WEB http://www.micrel.com
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or
other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel, Inc.
© 2002 Micrel, Incorporated.
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