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MIC7201 Datasheet, PDF (5/8 Pages) Micrel Semiconductor – GainBlock™ Difference Amplifier Preliminary Information
MIC7201
Symbol
VOUT
Parameter
Output Voltage Swing
Note 10
ISC
BW
SR
THD
en
IS
Output Short-Circuit Current
Bandwidth
Slew Rate
Total Harmonic Distortion
Input Referred Voltage Noise
Supply Current
Condition
output high, RL = 2k,
specified as VV+ – VOUT
output low, RL = 2k
output high, RL = 600Ω,
specified as VV+ – VOUT
output low, RL = 600Ω
sinking or sourcing, Note 6, Note 7
–3dB point
f = 1kHz
f = 10kHz
f = 1kHz
no load
Micrel
Min Typ Max Units
24
80
mV
120 mV
24
80
mV
120 mV
80
mV
mV
80
mV
mV
40
200
mA
250
kHz
0.5
V/µs
0.02
%
0.02
%
30
nV/ Hz
1.2
4.0
mA
Internal Op Amp Typical Characteristics
+2.2V ≤ VV+ ≤ 10V, VV– = 0V, VCM = VOUT = V+/2; RL = 1MΩ; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +85°C; unless noted
Symbol
Parameter
Condition
Min Typ Max Units
VOS
TCVOS
IB
IOS
RIN
CMRR
VCM
PSRR
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current
Input Offset Current
Input Resistance
Common-Mode Rejection Ratio
Input Common-Mode Voltage
Power Supply Rejection Ratio
0V ≤ VCM ≤ VV+
input low
input high
VV+ = VV– = 1.1V to 1.65V,
VCM = 0V
0.11
1.0
1.0
0.5
>1
80
–0.3
VV++0.3
60
mV
µV/°C
pA
pA
TΩ
dB
V
V
dB
General Note: Devices are ESD protected; however, handling precautions are recommended. All limits guaranteed by testing or statistical analysis.
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when
operating the device outside its recommended operating ratings.
Note 2: I/O pin voltage is any external voltage to which an input or output is referenced.
Note 3:
Note 4:
Note 5:
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max); the junction-to-ambient thermal
resistance, θJA; and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using:
PD = (TJ(max) – TA) / θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Thermal resistance, θJA, applies to a part soldered on a printed-circuit board.
Human body model, 1.5k in series with 100pF.
Note 6: Short circuit may cause the device to exceed maximum allowable power dissipation. See Note 3.
Note 7: Shorting VOUT to V+ when V+ > 10V may damage the device.
Note 8: Limited by internal bias-network resistors. Power supply must be “clean.” Power supply should be bypassed as shown in typical application
circuit.
Note 9: The gain error specification applies to differential, inverting, and noninverting gains.
Note 10: Since the part is specified in a single-supply configuration, the output load (RL) is a Thevenin equivalent value. The actual load consists of 2 ×
RL to ground and 2 × RL to the supply (V+).
December 1998
5
MIC7201