MIC7111_05 Datasheet, PDF (5/8 Pages) Micrel Semiconductor – 1.8V IttyBitty Rail-to-Rail Input/Output Op Amp

MIC7111
Micrel
Symbol
Parameter
Condition
Min Typ Max Units
I_B
Input Bias Current
1
10
pA
500 pA
I_OS
Input Offset Current
0.01 0.5
pA
75
pA
R_IN
+PSRR
–PSRR
CMRR
C_IN
V_OUT
Input Resistance
Positive Power Supply
Rejection Ratio
Negative Power Supply
Rejection Ratio
Common-Mode Rejection Ratio
Common Mode Input Capacitance
Output Voltage Swing
5V ≤ V_V+ ≤ 10V, V_V– = 0V,
V_CM = V_OUT = 2.5V
–5V ≤ V_V– ≤ –10V, V_V+ = 0V,
V_CM = V_OUT = –2.5V
V_CM = –0.2V to +10.2V
output high, R_L = 100k,
specified as V_V+ – V_OUT
output low, R_L = 100k
>10
TΩ
65
95
dB
65
95
dB
60
85
dB
3
pF
0.45 2.5 mV
2.5 mV
0.45 2.5 mV
2.5 mV
output high, R_L = 2k,
specified as V_V+ – V_OUT
output low, R_L = 2k
24
80
mV
120 mV
24
80
mV
120 mV
I_SC
A_VOL
Output Short Circuit Current
Note 6
Voltage Gain
sourcing, V_OUT = 0V
sinking, V_OUT = 10V
sourcing
sinking
100 200
100 200
500
500
mA
mA
V/mV
V/mV
I_S
Supply Current
V_V+ = 10V, V_OUT = V_V+/2
25
65
µA
AC Electrical Characteristics (10V)
V+ = +10V, V– = 0V, V_CM = V_OUT = V_V+/2; R_L = 1M; T_J = 25°C, bold values indicate –40°C ≤ T_J ≤ +85°C; unless noted
Symbol
Parameter
Condition
Min Typ Max
Units
SR
GBW
Slew Rate
Gain Bandwidth Product
voltage follower, 1V step, R_L = 100k@1.35V
V_OUT = 1V_P–P
0.02
25
V/µs
kHz
φ_M
Phase Margin
G_M
Gain Margin
50
°
15
dB
e_N
Input Referred Voltage Noise
f = 1kHz, V_CM = 1.0V
110
nV/ Hz
i_N
Input Referred Current Noise
f = 1kHz
0.03
pA/ Hz
General Notes: Devices are ESD protected; however, handling precautions are recommended. All limits guaranteed by testing on statistical analysis.
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when
operating the device outside its recommended operating ratings.
Note 2: I/O Pin Voltage is any external voltage to which an input or output is referenced.
Note 3:
Note 4:
Note 5:
The maximum allowable power dissipation is a function of the maximum junction temperature, T_J(max); the junction-to-ambient thermal
resistance, θ_JA; and the ambient temperature, T_A. The maximum allowable power dissipation at any ambient temperature is calculated using:
P_D = (T_J(max) – T_A) ÷ θ_JA. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Thermal resistance, θ_JA, applies to a part soldered on a printed-circuit board.
Human body model, 1.5k in series with 100pF.
Note 6: Short circuit may cause the device to exceed maxium allowable power dissipation. See Note 3.
January 2005
5
MIC7111