SY89855U Datasheet, PDF (4/13 Pages) Micrel Semiconductor – Precision Low Power Differential LVPECL 4:1 MUX with 1:2 Fanout and Internal Termination

Micrel, Inc.
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V_CC) ............................–0.5V to +4.0V
Input Voltage (V_IN) ....................................–0.5V to V_CC
LVPECL Output Current (I_OUT)
Continuous................................................. ±50mA
Surge ....................................................... ±100mA
Termination Current
Source or Sink Current on V_T .................. ±100mA
Input Current
Source or Sink Current on IN, /IN.............. ±50mA
Current (V_REF-AC)
Source or Sink Current on V_REF-AC ............... ±2mA
Lead Temperature (soldering, 20sec.) ...............260°C
Storage Temperature (T_s) ................ –65°C to +150°C
SY89855U
Operating Ratings⁽²⁾
Supply Voltage (V_CC) .....................+2.375V to +2.625V
.....................................................+3.0V to +3.6V
Ambient Temperature (T_A)....................–40°C to +85°C
Package Thermal Resistance⁽³⁾
MLF^® (θ_JA)
Still-Air......................................................35°C/W
500lfpm ....................................................28°C/W
MLF^® (ψ_JB)
Junction-to-Board.....................................16°C/W
DC Electrical Characteristics⁽⁴⁾
T_A = –40°C to +85°C, unless otherwise noted.
Symbol Parameter
Condition
Min
Typ
Max Units
V_CC
Power Supply Voltage
V_CC = 2.5V
V_CC = 3.3V
2.375
2.5
2.625
V
3.0
3.3
3.6
V
I_CC
Power Supply Current
No load, max. V_CC.
65
85
mA
R_IN
Input Resistance
(IN-to-VT)
45
50
55
Ω
R_{DIFF_IN} Differential Input Resistance
(IN-to-/IN, /IN-to-V_T)
90
100
110
Ω
V_IH
Input High Voltage
(IN, /IN)
V_CC– 1.2
V_CC
V
V_IL
Input Low Voltage
(IN, /IN)
0
V_IH– 0.1
V
V_IN
Input Voltage Swing
(IN-to-/IN)
See Figure 1a.
100
1700
mV
V_{DIFF_IN} Differential Input Voltage Swing See Figure 1b.
200
mV
|IN - /IN |
V_{T_IN}
Maximum Input Voltage
(IN-to-V_T)
1.28
V
V_REF-AC Output Reference Voltage
V_CC– 1.3 V_CC– 1.2 V_CC– 1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θ_JA and ψ_JB
values are determined for a 4-layer board in still-air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
February 2007
4
M9999-022007-B
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