SY89854U_10 Datasheet, PDF (4/13 Pages) Micrel Semiconductor – Precision Low Power 1:4 LVPECL Fanout

Micrel, Inc.
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V_CC) ..........................–0.5V to +4.0V
Input Voltage (V_IN) ..................................–0.5V to V_CC
LVPECL Output Current (I_OUT)
Continuous ................................................. 50mA
Surge........................................................ 100mA
Termination Current⁽³⁾
Source or sink current on V_T .................... ±50mA
Input Current
Source or sink current on IN, /IN.............. ±50mA
VREF-AC Current⁽³⁾
Source or sink current ................................ ±2mA
Lead Temperature (soldering, 20sec.) ...........+260°C
Storage Temperature (T_s)..................–65°C to 150°C
SY89854U
Operating Ratings⁽²⁾
Supply Voltage (V_CC).................. +2.375V to +2.625V
......................................................+3.0V to +3.6V
Ambient Temperature (T_A)................ –40°C to +85°C
Package Thermal Resistance⁽⁴⁾
QFN (θ_JA)
Still-Air ..................................................... 60°C/W
QFN (ψ_JB)
Junction-to-Board .................................... 38°C/W
DC Electrical Characteristics ⁽⁵⁾
T_A = –40°C to +85°C, unless otherwise stated.
Symbol Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
2.5
2.625
V
3.0
3.3
3.6
V
ICC
Power Supply Current
No load, max. VCC
55
78
mA
RDIFF_IN
Differential Input Resistance
(IN, /IN)
90
100
110
Ω
RIN
Input Resistance
(IN-to-VT)
45
50
55
Ω
VIH
Input High Voltage
(IN, /IN)
Note 6
VCC –1.6
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH –0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
(IN, /IN)
See Figure 1b.
0.2
V
VT_IN
IN-to-VT
1.28
V
Notes:
1. Permanent device damage may occur if the Absolute Maximum Ratings are exceeded. This is a stress rating only and functional operation
is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to Absolute Maximum Ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θJA and
ψJB are calculated based on a 4-layer board in still air, unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.\
6. VIH (min) not lower than 1.2V.
August 2007
4
M9999-082907-C
[e-mail] or [phone]