SY89847U Datasheet, PDF (4/15 Pages) Micrel Semiconductor – 1.5GHz Precision, LVDS 1:5 Fanout with 2:1 MUX and Fail Safe Input with Internal Termination

Micrel, Inc.
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V_CC) ..........................–0.5V to +4.0V
Input Voltage (V_IN) ..................................–0.5V to V_CC
LVPECL Output Current (I_OUT)
Continuous ................................................. 50mA
Surge........................................................ 100mA
Current (V_T)
Source or sink on VT pin........................ ±100mA
Input Current
Source or sink current on (IN, /IN) ........... ±50mA
Current (V_REF)
Source or sink current on V_REF-AC(4) ......... ±0.5mA
Maximum operating Junction Temperature .....125°C
Lead Temperature (soldering, 20sec.) .............260°C
Storage Temperature (T_s)............... –65°C to +150°C
SY89847U
Operating Ratings⁽²⁾
Supply Voltage (V_CC).................. +2.375V to +2.625V
Ambient Temperature (T_A)................ –40°C to +85°C
Package Thermal Resistance⁽³⁾
MLF^® (θ _JA)
Still-Air ..................................................... 50°C/W
MLF^® (ψ _JB)
Junction-to-Board .................................... 31°C/W
DC Electrical Characteristics⁽⁵⁾
T_A = –40°C to +85°C, unless otherwise stated.
Symbol Parameter
Condition
Min
Typ
Max
Units
V_CC
Power Supply
2.375
2.5
2.625
V
I_CC
Power Supply Current
No load, max V_CC
90
130
mA
R_IN
Input Resistance
(IN-to-V_T)
45
50
55
Ω
R_{DIFF_IN} Differential Input Resistance
(IN-to-/IN)
90
100
110
Ω
V_IH
Input High Voltage
(IN, /IN)
0.1
V_CC
V
V_IL
Input Low Voltage
(IN, /IN)
0
V_IH–0.1
V
V_IN
Input Voltage Swing
See Figure 2a. Note 6
0.1
(IN, /IN)
1.0
V
V_{DIFF_IN} Differential Input Voltage Swing See Figure 2b.
0.2
V
|IN-/IN|
V_{IN_FSI}
Input Voltage Threshold that
Triggers FSI
30
100
mV
V_REF-AC Output Reference Voltage
I_VREF-AC = + 0.5mA
V_CC–1.3 V_CC–1.2 V_CC–1.1
V
V_{T_IN}
Voltage from Input to V_T
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θ_JA and
ψ_JB values are determined for a 4-layer board in still air unless otherwise stated.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. V_IN (max) is specified when V_T is floating.
March 2007
4
M9999-031307-A
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